Rohan Akolkar

Milton and Tamar Maltz Professor of Energy Innovation Chief Scientist (Joint Appointmet), Pacific Northwest National Laboratory Professor, Chemical Engineering Director, Electronic Design Center (EDC)
Develops new electrochemical processes for applications including nano-material fabrication, energy storage, electrometallurgy and sensors
Phone Number: (216) 368-4151 Fax Number: (216) 368-3016 Email: rohan.akolkar@case.edu

Research Interests

Electrodeposition for Energy; Electrometallurgy; Electrochemical phenomena in next-generation batteries, semiconductor devices, and sensors

Teaching Interests

Chemical Engineering Undergraduate and Graduate Courses, e.g., Introduction to Chemical Systems, Transport Phenomena, Electrochemical Engineering; Corrosion Fundamentals; Mathematics for Chemical Engineers

Other Affiliations

Chief Scientist (Joint Appointment) Pacific Northwest National Laboratory

Publications

Zhang, Y., Klein, J., Akolkar, R. N., Gurkan, B. N., & Maginn, E. N. (2022). Solvation Structure, Dynamics and Charge Transfer Kinetics of Cu2+ and Cu+ in Choline Chloride Ethylene Glycol Electrolytes. The Journal of Physical Chemistry C, 126 (34), 6493 - 6499.
Shaheen, N., Dean, W., Penley, D., Kersten, B., Rintamaki, J., Vukmirovic, M., Gurkan, B., & Akolkar, R. N. (2022). Electro–oxidation of nitroxide radicals: Adsorption–mediated charge transfer probed using SERS and potentiometry. Journal of Electrochemical Society, 169 (5).
Shaheen, N., Ijjada, M., Vukmirovic, M., & Akolkar, R. N. (2020). Mechanism of Electrochemical Oxidation of Nitroxide Radicals in Ethaline Deep Eutectic Solvent. Journal of The Electrochemical Society, 167 (14).
Vukmirovic, M., Adzic, R., & Akolkar, R. N. (2020). Copper Electrodeposition from Deep Eutectic Solvents—Voltammetric Studies Providing Insights into the Role of Substrate: Platinum vs Glassy Carbon. Journal of Physical Chemistry B, 124 (26), 5465-5475.
Shaheen, N., Mahesh, I., Vukmirovic, M., & Akolkar, R. N. (2020). Hysteresis effects and roughness suppression efficacy of polyethylenimine additive in Cu electrodeposition in ethaline. Electrochemistry Communications, 115
Shaheen, N., Ijjada, M., Vukmirovic, M., & Akolkar, R. N. (2020). Electrolyte Additives for Controlling Roughness of Copper Electrodeposits Formed in Deep Eutectic Solvents. ECS Meeting Abstracts, MA2020-01 (19), 1206-1206.
Maraschky, A., & Akolkar, R. N. (2020). Temperature Dependence of Dendritic Lithium Electrodeposition: A Mechanistic Study of the Role of Transport Limitations within the SEI. J. Electrochem. Soc., 167, 062503 (2020). .
Gong, Y., & Akolkar, R. N. (2020). Electrochemical Atomic Layer Etching of Ruthenium. J. Electrochem. Soc., 167, 062510 (2020). .
Shaheen, N., Ijjada, M., Vukmirovic, M., & Akolkar, R. N. (2020). Mechanism of Electrochemical Oxidation of Nitroxide Radicals in Ethaline Deep Eutectic Solvent. J. Electrochem. Soc., 167, 143505 (2020).
Shaheen, N., Ijjada, M., Vukmirovic, M., & Akolkar, R. N. (2020). Hysteretic Effects and Roughness Suppression Efficacy of Polyethylenimine Additive in Cu Electrodeposition in Ethaline. Electrochemistry Communications, 115, 106721 (2020). .
Vukmirovic, M., Adzic, R., & Akolkar, R. N. (2020). Copper Electrodeposition from Deep Eutectic Solvents – Voltammetric Studies Providing Insights into the Role of Substrate: Platinum vs. Glassy Carbon. J. Phys. Chem. B, 124, 5465-5475 (2020).
Shen, X., Sinclair, N., Wainright, J. S., Akolkar, R. N., & Savinell, R. F. (2020). Evaluating and developing a reliable reference electrode for choline chloride based deep eutectic solvents. Journal of the Electrochemical Society, 167 , 086509.
Shen, X., Sinclair, N., Wainright, J., Akolkar, R. N., & Savinell, R. N. (2020). Evaluating and developing reliable reference electrode for choline chloride based deep eutectic solvents. J. Electrochem. Soc., 167, 086509 (2020). .
Liu, T., Liu, X., Bhattacharya, S., Ye, Z., He, R., Gao, X., Akolkar, R. N., & Sankaran, R. N. (2019). Plasma-Induced Fabrication and Straining of MoS 2 Films for the Hydrogen Evolution Reaction. ACS Applied Energy Materials.
Liu, T., Liu, X., Bhattacharya, S., Ye, Z., He, R., Gao, X., Akolkar, R. N., & Sankaran, R. N. (2019). Plasma-Induced Fabrication and Straining of MoS 2 Films for the Hydrogen Evolution Reaction. ACS Applied Energy Materials.
Zhan, X., Daniil, M., Liu, X., Willard, M. A., Akolkar, R. N., & Ernst, F. N. (2019). Effect of tungsten alloying on magnetic properties of amorphous Ni--P. Journal of Alloys and Compounds, 786 , 742-749.
Liu, X., Bolton, O., & Akolkar, R. N. (2019). Experimental and Modeling Studies of the Hysteresis Behavior and Dendrite Suppression Efficacy of a Novel Electrolyte Additive in Zinc Electrodeposition. J. Electrochem. Soc., 166 (13) , D583-.
Joi, A., Venkatraman, K., Tso, K., Dictus, D., Dordi, Y., Wu, P., Pao, C., & Akolkar, R. N. (2019). Editors' Choice�Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes. ECS Journal of Solid State Science and Technology, 8 (9), P516-P521.
Joi, A., Venkatraman, K., Watson, S., Dries, D., Dordi, Y., Wu, P., Paolini, R., & Akolkar, R. N. (2019). Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes. ECS J. Solid State Sci. Technol., 8 (9) , P516-.
Venkatraman, K., Gusley, R., Lesak, A., & Akolkar, R. N. (2019). Electrochemistry-Enabled Atomic Layer Deposition of Copper: Investigation of the Deposit Growth Rate and Roughness. J. Vac Sci. Technol. A, 37 , 020901.
Liu, X., Bolton, O., & Akolkar, R. N. (2019). Experimental and Modeling Studies of the Hysteresis Behavior and Dendrite Suppression Efficacy of an Electrolyte Additive in Zinc Electrodeposition. Journal of The Electrochemical Society, 166 (13), D583-D588.
Shen, D., Vukmirovic, M., & Akolkar, R. N. (2019). Understanding the Role of Complexation in the Charge-Transfer Kinetics of the Cu2+ + e ↔ Cu1+ Redox Reaction in Ethaline Deep Eutectic Solvent. J. Electrochem. Soc., 166 (15) , E526-E532.
Shen, D., Steinberg, K., & Akolkar, R. N. (2018). Avoiding Pitfalls in the Determination of Reliable Electrochemical Kinetics Parameters for the Cu2+ → Cu1+ Reduction Reaction in Deep Eutectic Solvents. J. Electrochem. Soc., 165 (14), E808-E815.
Venkatraman, K., Joi, A., Dordi, Y., & Akolkar, R. N. (2018). Electroless atomic layer deposition of copper. Electrochemistry Communications, 91 , 45-48.
Liu, X., Venkatraman, K., & Akolkar, R. N. (2018). Communication�Electrochemical Sensor Concept for the Detection of Lead Contamination in Water Utilizing Lead Underpotential Deposition. Journal of The Electrochemical Society, 165 (2), B9-B11.
Maraschky, A., & Akolkar, R. N. (2018). Mechanism Explaining the Onset Time of Dendritic Lithium Electrodeposition via Considerations of the Li + Transport within the Solid Electrolyte Interphase. Journal of The Electrochemical Society, 165 (14), D696-D703.
Gong, Y., Venkatraman, K., & Akolkar, R. N. (2018). Communication�Electrochemical Atomic Layer Etching of Copper. Journal of The Electrochemical Society, 165 (7), D282-D284.
Zhan, X., Zhang, P., Voyles, P., Liu, X., Akolkar, R. N., & Ernst, F. N. (2017). Effect of tungsten alloying on short-to-medium-range-order evolution and crystallization behavior of near-eutectic amorphous Ni–P. Acta Materialia, 122 , 400-411.
Liu, X., Richtering, W., & Akolkar, R. N. (2017). Investigation of the Kinetics and Mass Transport Aspects of Hydrogen Evolution during Electroless Deposition of Nickel–Phosphorus. Journal of The Electrochemical Society, 164 (7), D498-D504.
Venkatraman, K., Dordi, Y., & Akolkar, R. N. (2017). Electrochemical Atomic Layer Deposition of Cobalt Enabled by the Surface-Limited Redox Replacement of Underpotentially Deposited Zinc. Journal of The Electrochemical Society [00134651], 164 (2), D104-D109.
Yu, L., & Akolkar, R. N. (2017). Lead underpotential deposition for the surface characterization of silver ad-atom modified gold electrocatalysts for glucose oxidation. Journal of Electroanalytical Chemistry, 792 , 61-65.
Shen, D., & Akolkar, R. N. (2017). Electrodeposition of Neodymium from NdCl 3 -Containing Eutectic LiCl–KCl Melts Investigated Using Voltammetry and Diffusion-Reaction Modeling. Journal of The Electrochemical Society, 164 (8), H5292-H5298.
Kumar Rao, K., Ferguson, M., Murphy, K., Zhao, J., Lacks, D. J., & Akolkar, R. N. (2016). Electrochemical characterization of micro-cracks in polyurethane resin films deposited on metallic surfaces. J. Appl. Electrochem, 46 , 1237.
Venkatraman, K., Gusley, R., Yu, L., Dordi, Y., & Akolkar, R. N. (2016). Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc. Journal of The Electrochemical Society [00134651], 163 (12), D3008-D3013.
Zhao, M., Yu, L., Akolkar, R. N., & Anderson, A. N. (2016). Mechanism of Electroless Copper Deposition from [Cu II EDTA] 2– Complexes Using Aldehyde-Based Reductants. Journal of Physical Chemistry C [19327447], 120 (43), 24789-24793.
Rao, K., Ferguson, M., Murphy, K., Zhao, J., Lacks, D. J., & Akolkar, R. N. (2016). Electrochemical characterization of micro-cracks in polyurethane resin films deposited on metallic surfaces. Journal of Applied Electrochemistry, 46 (12), 1237-1243.
Banik, S., Rao, K., & Akolkar, R. N. (2016). Determination of the Diffusion-Adsorption Properties of Polymeric Electrolyte Additives Using an Additive Injection Method Implemented on a Rotating Disc Electrode. Journal of The Electrochemical Society [00134651], 163 (9), E241-E247.
Miller, A., Yu, L., Blickensderfer, J., & Akolkar, R. N. (2015). Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers. Journal of Electrochemical Society, 162 (14), D630-D634.
Banik, S., & Akolkar, R. N. (2015). Suppressing Dendritic Growth during Alkaline Zinc Electrodeposition using Polyethylenimine Additive. Electrochimica Acta/Elsevier, 179 , 475-481.
Yu, L., Vashaei, Z., Ernst, F., & Akolkar, R. N. (2015). Electroless Copper Deposition on Ruthenium: Effect of Additive on Growth, Coalescence and Roughness EvolutionElectroless Copper Deposition on Ruthenium: Effect of Additive on Growth, Coalescence and Roughness Evolution. Journal of the Electrochemical Society, 163 , D374-D378.
Kung, C., Lin, P., Xue, Y., Akolkar, R. N., Dai, L. N., Yu, X. N., & Liu, C. N. (2014). Three dimensional graphene foam supported platinum–ruthenium bimetallic nanocatalysts for direct methanol and direct ethanol fuel cell applications. Journal of Power Sources, 256 , 329–335.
Akolkar, R. N. (2014). Modeling dendrite growth during lithium electrodeposition at sub-ambient temperature. Journal of Power Sources, 246 , 84-89.
Akolkar, R. N., & Sankaran, R. N. (2013). Charge transfer processes at the interface between plasmas and liquids. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 31 (5).
Yu, L., Guo, L., Preisser, R., & Akolkar, R. N. (2013). Autocatalysis during Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent. Journal of Electrochemical Society, 160 (12), D3004-D3008.
Banik, S., & Akolkar, R. N. (2013). Suppressing Dendrite Growth during Zn electrodeposition by PEG-200 additive. Journal of Electrochemical Society, 160 (11), D519-D523.
Joi, A., Akolkar, R. N., & Landau, U. N. (2013). Pulse Electrodeposition of Copper-Manganese Alloy for Application in Interconnect Metallization. Journal of Electrochemical Society, 160 (12), D3145-D3148.